IWIPP 2027

IEEE International Workshop on Integrated Power Packaging

– | Kitakyushu, Japan


IWIPP focuses on integrated power packaging and related technologies for power electronic systems, including power modules, packaging, interconnections, thermal management, and reliability.


Keywords
Electrical engineering, power electronics, electronic packaging, power modules, thermal management

Deadlines
Paper Submission:  Jan. 03, 2027
Early-Bird Registration:  N/A
Organizer
IEEE Electronics Packaging Society
info@ieeedeis.org
Official event website


Other Details
Type of Event:  Workshop
Type of Review:  Others




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