ECTC 2027

IEEE Electronic Components and Technology Conference

– | Denver, Colorado, United States


ECTC covers electronic components and advanced packaging technologies, including semiconductor packaging, interconnects, materials, reliability, optoelectronics, power electronics, and electronic-system integration.


Keywords
Electrical engineering, electronic components, semiconductor packaging, interconnects, electronics reliability

Deadlines
Paper Submission:  Oct. 08, 2026
Early-Bird Registration:  N/A
Organizer
IEEE Electronics Packaging Society
info@ectc.net
Official event website


Other Details
Type of Event:  Conference
Type of Review:  Others




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